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Reverse
Engineering

Overview
Our Capabilities
Technical Services
Intellectual Property
Resources – Case study
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Bringing down cost of Reverse Engineering can unlock hidden value of semiconductor portfolios and enable further investment in semiconductor Research

Do you want to determine if there is an unauthorized use of your IP in a product or process?

Overview

Researchwire helps companies to test products and their functions. We have technology capability to handle products such as:

  • Semiconductor ICs
  • Telcom equipment
  • IoT platforms
  • Wi Fi Routers
  • Displays
  • Sensors

Testing and analysis can reveal details about specification of products, operating parameters, manufacturing process steps, packaging materials and component suppliers. Bringing down cost of such testing can help us analyse large set of products and patents.

System Analysis

Different system components and their integration into the system are analysed.

Techniques such as teardown, decapsulation, parameter measurement and imaging are utilized. This analysis provides macro level details about products and enable next level of testing and analysis.

Process Analysis

Reveal details about manufacturing process of semiconductor ICs.

Techniques such as SEM, FIBcut, TEM and EDS mapping are utilized. Semiconductor process node, materials used for different layers, isolation technology and manufacturing faults are uncovered after the analysis.

Circuit Analysis

Reveal semiconductor circuit structure and related functions.

All metal layers are removed one by one and detailed SEM images are taken for each layer. VLSI software stitches all images together and create 3D model of semiconductor structure. Circuit components and their interconnection are revealed to explain functions of the circuit.

Technical Services

We help clients in analysing products and patents. In the first step we identify patent to product combination for which reverse engineering will reveal the relevant details. In the next step we provide details of RE steps needed to uncover relevant details. Such steps can be:

  • Product Teardown
  • IC De-capsulation
  • X-Ray Imaging
  • High-magnification Optical Imaging
  • SEM Imaging
  • FIB Cut
  • TEM Imaging
  • Material Characterization
  • Probe measurement
  • Source code analysis
  • Packet analysis

Intellectual Property

Reverse engineering techniques can be utilized to understand product details and Patent overlap with products. RE reports can be helpful in IP field in various ways such as:

  • Patent litigation infringement evidence
  • Damages calculation
  • Patent expiry analysis
  • Competitor SWOT analysis
  • Patent transactions

High cost of RE analysis prohibits large number of semiconductor patents from being licensed or sold. Bringing down cost of RE analysis can unlock hidden value of semiconductor portfolios and enable further investment in semiconductor R&D.

Resources - Case Study

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