About Reverse Engineering

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Reverse Engineering (RE) is an important and quite effective tool in areas of IP infringement and litigation. Also sometime known as product teardown, the method involves acquiring a product and disassembling it in order to understand how it was built, how it works and what it is made of.

ResearchWire’s team of very specialized experts use RE and product teardown to help companies realize monetization potential of their IP portfolios, verify proof of infringements, help cut cost by components and respective cost identification as well as decoding overall technology landscaping and competitive strategy.

Insights

Technical Services

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Intellectual Property

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Technical Services

Our Capabilities

Dedicated subject matter experts who have strong experience in Reverse engineering projects and can provide like Product teardown, IC decapsulation, Non destructive or destructive imaging using x-rays, SEM/TEM/EELS  imaging tools, or complete circuit extraction with specified focus on,

Meet Our Experts
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System Analysis

Systematic teardown of various devices. Giving detailed component reports and billing of materials

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Process Analysis

Identifies how devices are built and what they are made of – analysis of patented semiconductor, optical and MEM processes, packaging and/or layout features;

Circuit Analysis

Identifies how devices work — delayer to the transistor level, then extract interconnections and components to create schematics and netlists;